DARPA Extends Deadline for Developing Sensors That Withstand Extreme Temperatures

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DARPA Extends Deadline for Developing Sensors That Withstand Extreme Temperatures

U.S. defense technology companies now have an additional two weeks to respond to a military research project by the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va. This project aims to develop sensors that can withstand extreme temperatures, such as those found in future hypersonic and jet engine applications. The initial deadline for response data submission has been extended from August 15 to August 31, 2023.

Under the High Operational Temperature Sensors (HOTS) program, DARPA is seeking the development of electronics capable of operating in environments with temperatures reaching at least 800 degrees Celsius. Transducers and signal-conditioning microelectronics are key components of these sensors, which will enable accurate state-of-health monitoring and closed-loop operation of systems in high-temperature environments.

Various systems, including hypersonic aircraft, missiles, automotive, jet engine turbines, and oil-and-gas systems, often encounter thermal conditions that exceed the capabilities of current physical sensors. Today’s state-of-the-art physical sensors, limited by their complementary metal oxide silicon (CMOS) materials, can typically only operate up to temperatures of 225 degrees Celsius.

For successful implementation, the HOTS program aims to overcome three key technical challenges: achieving long-lasting, high-bandwidth transistors at high temperatures; achieving high-sensitivity transducers at high temperatures; and integrating high operating temperature sensors without compromising performance.

DARPA envisions a 36-month program with two phases commencing in January 2024. Industry representatives can attend a briefing on the HOTS program on May 31, 2023, at the Booz Allen Hamilton Auditorium in McLean, Va., to gain further insights. Interested companies were asked to submit abstracts in June and are required to submit full proposals no later than August 31, 2023, through the DARPA Broad Agency Announcement (BAA) website.

The development of physical sensors capable of operating in high-temperature environments is vital for the advancement of numerous commercial and defense systems. By pushing the boundaries of current limitations, DARPA’s HOTS program aims to unlock new possibilities for hypersonic and other high-temperature applications, ultimately enhancing the performance and reliability of these systems for the future.

To register for the May 31 briefing, visit the online registration page linked at [https://web.cvent.com/event/ea5d72ae-6f18-4d62-b112-545ac23d3f32/summary].

Companies looking to participate in the DARPA HOTS program should take advantage of this extended deadline to contribute their expertise and innovation to this groundbreaking research initiative.

Keywords: DARPA, sensors, extreme temperatures, HOTS program, transducers, signal-conditioning microelectronics, state-of-health monitoring, hypersonic, jet engine, temperature limitations, CMOS materials, technical challenges, program phases, advanced defense systems.

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